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Chemical content PMPB29XPEA

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Type numberPackagePackage descriptionTotal product weight
PMPB29XPEASOT1220SOT12207.40386 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070928115312601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00945
FillerSilver (Ag)7440-22-40.0588084.000000.79418
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09455
Isobornyl Methacrylate7534-94-30.003505.000000.04727
subTotal0.07000100.000000.94545
DieDoped siliconSilicon (Si)7440-21-30.52000100.000007.02336
subTotal0.52000100.000007.02336
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.53382
Magnesium (Mg)7439-95-40.004220.145900.05695
Nickel (Ni)7440-02-00.084352.918801.13932
Silicon (Si)7440-21-30.018280.632400.24685
Pure metal layerGold (Au)7440-57-50.000960.033300.01300
Nickel (Ni)7440-02-00.074012.561000.99965
Palladium (Pd)7440-05-30.003270.113000.04411
subTotal2.89000100.0000039.03370
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.58720
Silica fused60676-86-02.2380060.0000030.22748
Flame retardantMetal hydroxideProprietary0.111903.000001.51137
ImpurityBismuth (Bi)7440-69-90.018650.500000.25190
PigmentCarbon black1333-86-40.018650.500000.25190
PolymerEpoxy resin systemProprietary0.261107.000003.52654
Phenolic resinProprietary0.223806.000003.02275
subTotal3.73000100.0000050.37914
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00127
Tin solderTin (Sn)7440-31-50.1699099.940002.29472
subTotal0.17000100.000002.29609
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0238699.990000.32220
subTotal0.02386100.000000.32223
total7.40386100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.