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Chemical content PMPB55XNEA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB55XNEASOT1220SOT12207.03735 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070283115712601235Hsin-chu, Taiwan; Dongguan, China; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00995
FillerSilver (Ag)7440-22-40.0588084.000000.83554
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09947
Isobornyl Methacrylate7534-94-30.003505.000000.04973
subTotal0.07000100.000000.99469
DieDoped siliconSilicon (Si)7440-21-30.15000100.000002.13148
subTotal0.15000100.000002.13148
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956038.43653
Magnesium (Mg)7439-95-40.004220.145900.05992
Nickel (Ni)7440-02-00.084352.918801.19865
Silicon (Si)7440-21-30.018280.632400.25971
Pure metal layerGold (Au)7440-57-50.000960.033300.01368
Nickel (Ni)7440-02-00.074012.561001.05172
Palladium (Pd)7440-05-30.003270.113000.04641
subTotal2.89000100.0000041.06662
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000012.19067
Silica fused60676-86-02.2380060.0000031.80174
Flame retardantMetal hydroxideProprietary0.111903.000001.59009
ImpurityBismuth (Bi)7440-69-90.018650.500000.26501
PigmentCarbon black1333-86-40.018650.500000.26501
PolymerEpoxy resin systemProprietary0.261107.000003.71020
Phenolic resinProprietary0.223806.000003.18017
subTotal3.73000100.0000053.00289
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00134
Tin solderTin (Sn)7440-31-50.1699099.940002.41423
subTotal0.17000100.000002.41568
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0273599.990000.38862
subTotal0.02735100.000000.38866
total7.03735100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.