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Chemical content PMPB95ENEA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB95ENEASOT1220SOT12207.36859 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067476115412601235Manchester, United Kingdom; Sherman, United States Of America; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00950
FillerSilver (Ag)7440-22-40.0588084.000000.79798
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09500
Isobornyl Methacrylate7534-94-30.003505.000000.04750
subTotal0.07000100.000000.94998
DieDoped siliconSilicon (Si)7440-21-30.47000100.000006.37843
subTotal0.47000100.000006.37843
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.70869
Magnesium (Mg)7439-95-40.004220.145900.05722
Nickel (Ni)7440-02-00.084352.918801.14477
Silicon (Si)7440-21-30.018280.632400.24803
Pure metal layerGold (Au)7440-57-50.000960.033300.01306
Nickel (Ni)7440-02-00.074012.561001.00444
Palladium (Pd)7440-05-30.003270.113000.04432
subTotal2.89000100.0000039.22053
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.64266
Silica fused60676-86-02.2380060.0000030.37216
Flame retardantMetal hydroxideProprietary0.111903.000001.51861
ImpurityBismuth (Bi)7440-69-90.018650.500000.25310
PigmentCarbon black1333-86-40.018650.500000.25310
PolymerEpoxy resin systemProprietary0.261107.000003.54342
Phenolic resinProprietary0.223806.000003.03722
subTotal3.73000100.0000050.62027
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00128
Tin solderTin (Sn)7440-31-50.1699099.940002.30571
subTotal0.17000100.000002.30709
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0385999.990000.52370
subTotal0.03859100.000000.52375
total7.36859100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.