Chemical content PMV15ENEA

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Type numberPackagePackage descriptionTotal product weight
PMV15ENEASOT23TO-236AB9.27460 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934661151215112601235Dongguan, China; Manchester, United Kingdom; Sherman, United States Of America 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.33209
PolymerResin systemProprietary0.0092023.000000.09920
DieDoped siliconSilicon (Si)7440-21-30.47000100.000005.06760
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300033.39095
Iron (Fe)7439-89-60.082912.520000.89393
Lead (Pb)7439-92-10.000990.030000.01064
Phosphorus (P)7723-14-00.004940.150000.05321
Zinc (Zn)7440-66-60.006250.190000.06740
Pure metal layerSilver (Ag)7440-22-40.098042.980001.05710
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.22413
FillerSilica -amorphous-7631-86-90.014700.290000.15853
Silica fused60676-86-04.3678086.1500047.09427
HardenerPhenolic resinProprietary0.217504.290002.34515
PigmentCarbon black1333-86-40.009630.190000.10386
PolymerEpoxy resin systemProprietary0.439578.670004.73949
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000190.055500.00209
Tin solderTin (Sn)7440-31-50.3497999.940003.77148
WireImpurityNon hazardousProprietary0.000010.010000.00006
Pure metalCopper (Cu)7440-50-80.0545999.990000.58865
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.