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Chemical content PMV32UP

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Type numberPackagePackage descriptionTotal product weight
PMV32UPSOT23TO-236AB9.26620 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065645215612601235Dongguan, China; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.33239
PolymerResin systemProprietary0.0092023.000000.09929
subTotal0.04000100.000000.43168
DieDoped siliconSilicon (Si)7440-21-30.47000100.000005.07220
subTotal0.47000100.000005.07220
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300033.42122
Iron (Fe)7439-89-60.082912.520000.89474
Lead (Pb)7439-92-10.000990.030000.01065
Phosphorus (P)7723-14-00.004940.150000.05326
Zinc (Zn)7440-66-60.006250.190000.06746
Pure metal layerSilver (Ag)7440-22-40.098042.980001.05806
subTotal3.29000100.0000035.50539
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.22433
FillerSilica -amorphous-7631-86-90.014700.290000.15867
Silica fused60676-86-04.3678086.1500047.13696
HardenerPhenolic resinProprietary0.217504.290002.34727
PigmentCarbon black1333-86-40.009630.190000.10396
PolymerEpoxy resin systemProprietary0.439578.670004.74379
subTotal5.07000100.0000054.71498
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000190.055500.00210
Tin solderTin (Sn)7440-31-50.3497999.940003.77490
subTotal0.35000100.000003.77717
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0462099.990000.49854
subTotal0.04620100.000000.49859
total9.26620100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.