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Chemical content PMV50ENEA

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Type numberPackagePackage descriptionTotal product weight
PMV50ENEASOT23TO-236AB9.05830 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068715215412601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34002
PolymerResin systemProprietary0.0092023.000000.10156
subTotal0.04000100.000000.44158
DieDoped siliconSilicon (Si)7440-21-30.24000100.000002.64950
subTotal0.24000100.000002.64950
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.18828
Iron (Fe)7439-89-60.082912.520000.91527
Lead (Pb)7439-92-10.000990.030000.01090
Phosphorus (P)7723-14-00.004940.150000.05448
Zinc (Zn)7440-66-60.006250.190000.06901
Pure metal layerSilver (Ag)7440-22-40.098042.980001.08234
subTotal3.29000100.0000036.32028
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.22948
FillerSilica -amorphous-7631-86-90.014700.290000.16232
Silica fused60676-86-04.3678086.1500048.21882
HardenerPhenolic resinProprietary0.217504.290002.40115
PigmentCarbon black1333-86-40.009630.190000.10634
PolymerEpoxy resin systemProprietary0.439578.670004.85267
subTotal5.07000100.0000055.97078
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000190.055500.00214
Tin solderTin (Sn)7440-31-50.3497999.940003.86154
subTotal0.35000100.000003.86385
WireImpurityNon hazardousProprietary0.000010.010000.00008
Pure metalCopper (Cu)7440-50-80.0682499.990000.75338
subTotal0.06825100.000000.75346
total9.05830100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.