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Chemical content PMV50XPA

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Type numberPackagePackage descriptionTotal product weight
PMV50XPASOT23TO-236AB8.95913 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665703215212601235Dongguan, China; Kuching Sarawak, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34378
PolymerResin systemProprietary0.0092023.000000.10269
subTotal0.04000100.000000.44647
DieDoped siliconSilicon (Si)7440-21-30.15100100.000001.68543
subTotal0.15100100.000001.68543
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.56672
Iron (Fe)7439-89-60.082912.520000.92540
Lead (Pb)7439-92-10.000990.030000.01102
Phosphorus (P)7723-14-00.004940.150000.05508
Zinc (Zn)7440-66-60.006250.190000.06977
Pure metal layerSilver (Ag)7440-22-40.098042.980001.09433
subTotal3.29000100.0000036.72232
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.23202
FillerSilica -amorphous-7631-86-90.014700.290000.16411
Silica fused60676-86-04.3678086.1500048.75256
HardenerPhenolic resinProprietary0.217504.290002.42772
PigmentCarbon black1333-86-40.009630.190000.10752
PolymerEpoxy resin systemProprietary0.439578.670004.90638
subTotal5.07000100.0000056.59031
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00018
Non hazardousProprietary0.000190.055500.00217
Tin solderTin (Sn)7440-31-50.3497999.940003.90429
subTotal0.35000100.000003.90664
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0070399.990000.07845
subTotal0.00703100.000000.07846
WireImpurityNon hazardousProprietary0.000010.010000.00006
Pure metalCopper (Cu)7440-50-80.0510999.990000.57031
subTotal0.05110100.000000.57037
total8.95913100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.