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Chemical content PMV65XPE

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Type numberPackagePackage descriptionTotal product weight
PMV65XPESOT23TO-236AB8.98462 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068499215412601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34281
PolymerResin systemProprietary0.0092023.000000.10240
subTotal0.04000100.000000.44521
DieDoped siliconSilicon (Si)7440-21-30.21000100.000002.33733
subTotal0.21000100.000002.33733
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.46865
Iron (Fe)7439-89-60.082912.520000.92278
Lead (Pb)7439-92-10.000990.030000.01099
Phosphorus (P)7723-14-00.004940.150000.05493
Zinc (Zn)7440-66-60.006250.190000.06957
Pure metal layerSilver (Ag)7440-22-40.098042.980001.09122
subTotal3.29000100.0000036.61814
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.23136
FillerSilica -amorphous-7631-86-90.014700.290000.16365
Silica fused60676-86-04.3678086.1500048.61424
HardenerPhenolic resinProprietary0.217504.290002.42084
PigmentCarbon black1333-86-40.009630.190000.10722
PolymerEpoxy resin systemProprietary0.439578.670004.89246
subTotal5.07000100.0000056.42977
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00018
Non hazardousProprietary0.000190.055500.00216
Tin solderTin (Sn)7440-31-50.3497999.940003.89321
subTotal0.35000100.000003.89555
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0246299.990000.27404
subTotal0.02462100.000000.27407
total8.98462100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.