Chemical content PMV65XPEA

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Type numberPackagePackage descriptionTotal product weight
PMV65XPEASOT23TO-236AB9.00278 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934068708215212601235Seremban, Malaysia; Sherman, United States Of America; Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34212
PolymerResin systemProprietary0.0092023.000000.10219
DieDoped siliconSilicon (Si)7440-21-30.21000100.000002.33261
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.39912
Iron (Fe)7439-89-60.082912.520000.92092
Lead (Pb)7439-92-10.000990.030000.01096
Phosphorus (P)7723-14-00.004940.150000.05482
Zinc (Zn)7440-66-60.006250.190000.06943
Pure metal layerSilver (Ag)7440-22-40.098042.980001.08902
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.23090
FillerSilica -amorphous-7631-86-90.014700.290000.16332
Silica fused60676-86-04.3678086.1500048.51618
HardenerPhenolic resinProprietary0.217504.290002.41595
PigmentCarbon black1333-86-40.009630.190000.10700
PolymerEpoxy resin systemProprietary0.439578.670004.88259
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000190.055500.00216
Tin solderTin (Sn)7440-31-50.3497999.940003.88536
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0427899.990000.47518
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.