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Chemical content PMV74EPE

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Type numberPackagePackage descriptionTotal product weight
PMV74EPESOT23TO-236AB8.99000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661283215112601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34260
PolymerResin systemProprietary0.0092023.000000.10234
subTotal0.04000100.000000.44494
DieDoped siliconSilicon (Si)7440-21-30.22000100.000002.44716
subTotal0.22000100.000002.44716
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.44802
Iron (Fe)7439-89-60.082912.520000.92222
Lead (Pb)7439-92-10.000990.030000.01098
Phosphorus (P)7723-14-00.004940.150000.05489
Zinc (Zn)7440-66-60.006250.190000.06953
Pure metal layerSilver (Ag)7440-22-40.098042.980001.09057
subTotal3.29000100.0000036.59621
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.23122
FillerSilica -amorphous-7631-86-90.014700.290000.16355
Silica fused60676-86-04.3678086.1500048.58515
HardenerPhenolic resinProprietary0.217504.290002.41939
PigmentCarbon black1333-86-40.009630.190000.10715
PolymerEpoxy resin systemProprietary0.439578.670004.88953
subTotal5.07000100.0000056.39599
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00018
Non hazardousProprietary0.000190.055500.00216
Tin solderTin (Sn)7440-31-50.3497999.940003.89088
subTotal0.35000100.000003.89322
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0175099.990000.19464
subTotal0.01750100.000000.19466
total8.99000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.