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Chemical content PMV88ENE

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Type numberPackagePackage descriptionTotal product weight
PMV88ENESOT23TO-236AB8.99764 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664416215112601235Dongguan, China; Manchester, United Kingdom; Sherman, United States Of America; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34231
PolymerResin systemProprietary0.0092023.000000.10225
subTotal0.04000100.000000.44456
DieDoped siliconSilicon (Si)7440-21-30.24000100.000002.66737
subTotal0.24000100.000002.66737
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.41877
Iron (Fe)7439-89-60.082912.520000.92144
Lead (Pb)7439-92-10.000990.030000.01097
Phosphorus (P)7723-14-00.004940.150000.05485
Zinc (Zn)7440-66-60.006250.190000.06947
Pure metal layerSilver (Ag)7440-22-40.098042.980001.08964
subTotal3.29000100.0000036.56514
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.23103
FillerSilica -amorphous-7631-86-90.014700.290000.16341
Silica fused60676-86-04.3678086.1500048.54390
HardenerPhenolic resinProprietary0.217504.290002.41733
PigmentCarbon black1333-86-40.009630.190000.10706
PolymerEpoxy resin systemProprietary0.439578.670004.88538
subTotal5.07000100.0000056.34811
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00018
Non hazardousProprietary0.000190.055500.00216
Tin solderTin (Sn)7440-31-50.3497999.940003.88757
subTotal0.35000100.000003.88991
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0076499.990000.08490
subTotal0.00764100.000000.08491
total8.99764100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.