Chemical content PMZ130UNE

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
PMZ130UNESOT883XQFN30.90272 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340686083154126030 s123520 s3D-22529 HAMBURG, Germany; Hsinchu, Taiwan; Manchester, United Kingdom; Hsin-chu, Taiwan; Dongguan, China; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.84190
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11598
Phenolic resinProprietary0.0013513.530000.14988
DieDoped siliconSilicon (Si)7440-21-30.06000100.000006.64658
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100044.49475
Magnesium (Mg)7439-95-40.000630.146000.06955
Nickel (Ni)7440-02-00.012532.913001.38757
Silicon (Si)7440-21-30.002710.631000.30057
MetallisationGold (Au)7440-57-50.000150.035000.01667
Nickel (Ni)7440-02-00.011852.755001.31231
Palladium (Pd)7440-05-30.000470.110000.05240
Mould CompoundFillerSilica -amorphous-7631-86-90.0740020.000008.19745
Silica fused60676-86-00.2386564.5000026.43677
Flame retardantMetal hydroxideProprietary0.011103.000001.22962
ImpuritySilicon Dioxide (SiO2)14808-60-70.001850.500000.20494
PigmentCarbon black1333-86-40.001110.300000.12296
PolymerPhenol Formaldehyde resin (generic)9003-35-40.008142.200000.90172
Phenolic resinProprietary0.009252.500001.02468
Tetramethylbiphenyl diglycidyl ether85954-11-60.025907.000002.86911
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.010000.00011
Bismuth (Bi)7440-69-90.000000.020000.00022
Iron (Fe)7439-89-60.000000.010000.00011
Lead (Pb)7439-92-10.000000.010000.00011
Tin solderTin (Sn)7440-31-50.0100099.950001.10721
WireImpurityNon hazardousProprietary0.000000.010000.00025
Pure metalGold (Au)7440-57-50.0227299.990002.51659
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.