Bipolar transistors


ESD protection, TVS, filtering and signal conditioning





Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMZ200UNE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMZ200UNESOT883XQFN30.89136 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934068609315312601235Dongguan, China; Sherman, United States Of America; Hsin-chu, Taiwan; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.85263
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11746
Phenolic resinProprietary0.0013513.530000.15179
DieDoped siliconSilicon (Si)7440-21-30.06000100.000006.73129
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100045.06182
Magnesium (Mg)7439-95-40.000630.146000.07043
Nickel (Ni)7440-02-00.012532.913001.40526
Silicon (Si)7440-21-30.002710.631000.30440
MetallisationGold (Au)7440-57-50.000150.035000.01688
Nickel (Ni)7440-02-00.011852.755001.32904
Palladium (Pd)7440-05-30.000470.110000.05306
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.54721
Silica fused60676-86-00.2220060.0000024.90576
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.011103.000001.24529
Ion trapping agentBismuth (Bi)7440-69-90.001850.500000.20755
PigmentCarbon black1333-86-40.001850.500000.20755
PolymerEpoxy resin systemProprietary0.025907.000002.90567
Phenolic resinProprietary0.022206.000002.49058
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00062
Tin solderTin (Sn)7440-31-50.0099999.940001.12121
WireImpurityNon hazardousProprietary0.000000.010000.00013
Pure metalGold (Au)7440-57-50.0113699.990001.27433
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.