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Chemical content PMZ320UPE

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Type numberPackagePackage descriptionTotal product weight
PMZ320UPESOT883XQFN30.89136 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068611315412601235Dongguan, China; Sherman, United States Of America; Hsin-chu, Taiwan; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.85263
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11746
Phenolic resinProprietary0.0013513.530000.15179
subTotal0.01000100.000001.12188
DieDoped siliconSilicon (Si)7440-21-30.06000100.000006.73129
subTotal0.06000100.000006.73129
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100045.06182
Magnesium (Mg)7439-95-40.000630.146000.07043
Nickel (Ni)7440-02-00.012532.913001.40526
Silicon (Si)7440-21-30.002710.631000.30440
MetallisationGold (Au)7440-57-50.000150.035000.01688
Nickel (Ni)7440-02-00.011852.755001.32904
Palladium (Pd)7440-05-30.000470.110000.05306
subTotal0.43000100.0000048.24089
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.54721
Silica fused60676-86-00.2220060.0000024.90576
Flame retardantMetal hydroxideProprietary0.011103.000001.24529
ImpurityBismuth (Bi)7440-69-90.001850.500000.20755
PigmentCarbon black1333-86-40.001850.500000.20755
PolymerEpoxy resin systemProprietary0.025907.000002.90567
Phenolic resinProprietary0.022206.000002.49058
subTotal0.37000100.0000041.50961
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00062
Tin solderTin (Sn)7440-31-50.0099999.940001.12121
subTotal0.01000100.000001.12188
WireImpurityNon hazardousProprietary0.000000.010000.00013
Pure metalGold (Au)7440-57-50.0113699.990001.27433
subTotal0.01136100.000001.27446
total0.89136100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.