×

Chemical content PMZB200UNE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMZB200UNESOT883BXQFN30.71166 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068606315212601235Dongguan, China; Hsin-chu, Taiwan; Sherman, United States Of America; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32038
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04414
Phenolic resinProprietary0.0004113.530000.05704
subTotal0.00300100.000000.42156
DieDoped siliconSilicon (Si)7440-21-30.06000100.000008.43099
subTotal0.06000100.000008.43099
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09443
Copper (Cu)7440-50-80.2632094.0000036.98395
Tin (Sn)7440-31-50.000670.240000.09443
Zinc (Zn)7440-66-60.000590.210000.08262
Pure metal layerGold (Au)7440-57-50.000220.080000.03148
Nickel (Ni)7440-02-00.013834.940001.94362
Palladium (Pd)7440-05-30.000810.290000.11410
subTotal0.28000100.0000039.34463
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000010.98839
Silica fused60676-86-00.2040060.0000028.66537
Flame retardantMetal hydroxideProprietary0.010203.000001.43327
ImpurityBismuth (Bi)7440-69-90.001700.500000.23888
PigmentCarbon black1333-86-40.001700.500000.23888
PolymerEpoxy resin systemProprietary0.023807.000003.34429
Phenolic resinProprietary0.020406.000002.86654
subTotal0.34000100.0000047.77562
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00156
Tin solderTin (Sn)7440-31-50.0199999.940002.80864
subTotal0.02000100.000002.81033
WireImpurityNon hazardousProprietary0.000000.010000.00012
Pure metalGold (Au)7440-57-50.0086699.990001.21703
subTotal0.00866100.000001.21715
total0.71166100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.