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Chemical content PMZB950UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMZB950UPESOT883BXQFN30.68032 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068789315412601235Dongguan, China; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33514
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04617
Phenolic resinProprietary0.0004113.530000.05966
subTotal0.00300100.000000.44097
DieDoped siliconSilicon (Si)7440-21-30.03000100.000004.40969
subTotal0.03000100.000004.40969
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09878
Copper (Cu)7440-50-80.2632094.0000038.68768
Tin (Sn)7440-31-50.000670.240000.09878
Zinc (Zn)7440-66-60.000590.210000.08643
Pure metal layerGold (Au)7440-57-50.000220.080000.03293
Nickel (Ni)7440-02-00.013834.940002.03316
Palladium (Pd)7440-05-30.000810.290000.11936
subTotal0.28000100.0000041.15712
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.49459
Silica fused60676-86-00.2040060.0000029.98589
Flame retardantMetal hydroxideProprietary0.010203.000001.49929
ImpurityBismuth (Bi)7440-69-90.001700.500000.24988
PigmentCarbon black1333-86-40.001700.500000.24988
PolymerEpoxy resin systemProprietary0.023807.000003.49835
Phenolic resinProprietary0.020406.000002.99859
subTotal0.34000100.0000049.97647
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00163
Tin solderTin (Sn)7440-31-50.0199999.940002.93803
subTotal0.02000100.000002.93979
WireImpurityNon hazardousProprietary0.000000.010000.00011
Pure metalGold (Au)7440-57-50.0073299.990001.07586
subTotal0.00732100.000001.07597
total0.68032100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.