Chemical content PNE20030EP-Q

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Type numberPackagePackage descriptionTotal product weight
PNE20030EP-QSOD128FlatPower32.92100 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934665089115312601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.82400100.000002.50296
ClipCopper alloyCopper (Cu)7440-50-85.2097099.8600015.82484
Iron (Fe)7439-89-60.005220.100000.01585
Phosphorus (P)7723-14-00.002090.040000.00634
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200035.33685
Iron (Fe)7439-89-60.011820.100000.03590
Phosphorus (P)7723-14-00.003550.030000.01077
Pure metal layerSilver (Ag)7440-22-40.171391.450000.52061
Mould CompoundFillerSilica -amorphous-7631-86-91.2210010.000003.70888
Silica fused60676-86-09.1575075.0000027.81659
PigmentCarbon black1333-86-40.036630.300000.11127
PolymerEpoxy resin systemProprietary0.940177.700002.85584
Phenolic resinProprietary0.854707.000002.59622
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.06304
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500007.02439
Silver alloySilver (Ag)7440-22-40.062502.500000.18985
Tin alloyTin (Sn)7440-31-50.125005.000000.37970
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.