Chemical content PNE20040EPE

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Type numberPackagePackage descriptionTotal product weight
PNE20040EPESOT1289BCFP1572.81800 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662617139412601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.20800100.000001.65893
ClipCopper alloyCopper (Cu)7440-50-87.3460299.8100010.08819
Iron (Fe)7439-89-60.011040.150000.01516
Phosphorus (P)7723-14-00.002940.040000.00404
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600047.27092
Iron (Fe)7439-89-60.034470.100000.04734
Phosphorus (P)7723-14-00.013790.040000.01893
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.83721
Silica fused60676-86-015.4950075.0000021.27908
PigmentCarbon black1333-86-40.061980.300000.08512
PolymerEpoxy resin systemProprietary1.590827.700002.18465
Phenolic resinProprietary1.446207.000001.98605
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12358
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.84274
Silver alloySilver (Ag)7440-22-40.225752.500000.31002
Tin alloyTin (Sn)7440-31-50.180602.000000.24802
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.