Chemical content PNE20080EPE-Q

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Type numberPackagePackage descriptionTotal product weight
PNE20080EPE-QSOT1289BCFP1573.38200 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662948139412601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.77200100.000002.41476
ClipCopper alloyCopper (Cu)7440-50-87.3460299.8100010.01065
Iron (Fe)7439-89-60.011040.150000.01504
Phosphorus (P)7723-14-00.002940.040000.00401
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600046.90761
Iron (Fe)7439-89-60.034470.100000.04697
Phosphorus (P)7723-14-00.013790.040000.01879
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.81540
Silica fused60676-86-015.4950075.0000021.11553
PigmentCarbon black1333-86-40.061980.300000.08446
PolymerEpoxy resin systemProprietary1.590827.700002.16786
Phenolic resinProprietary1.446207.000001.97078
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12263
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.75172
Silver alloySilver (Ag)7440-22-40.225752.500000.30764
Tin alloyTin (Sn)7440-31-50.180602.000000.24611
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.