Chemical content PQMB11

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Type numberPackagePackage descriptionTotal product weight
PQMB11SOT1216DFN1010B-61.23713 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934069743147312601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01778
FillerSilver (Ag)7440-22-40.0184884.000001.49378
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.17783
Isobornyl Methacrylate7534-94-30.001105.000000.08892
DieDoped siliconSilicon (Si)7440-21-30.08000100.000006.46658
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.18810
Magnesium (Mg)7439-95-40.000830.170000.06747
Nickel (Ni)7440-02-00.013942.840001.12716
Silicon (Si)7440-21-30.003040.620000.24607
Pure metal layerGold (Au)7440-57-50.000340.070000.02778
Nickel (Ni)7440-02-00.023034.690001.86140
Palladium (Pd)7440-05-30.002110.430000.17066
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.26640
Silica fused60676-86-00.3636060.0000029.39061
Flame retardantMetal hydroxideProprietary0.018183.000001.46953
ImpurityBismuth (Bi)7440-69-90.003030.500000.24492
PigmentCarbon black1333-86-40.003030.500000.24492
PolymerEpoxy resin systemProprietary0.042427.000003.42890
Phenolic resinProprietary0.036366.000002.93906
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00108
Tin solderTin (Sn)7440-31-50.0239999.940001.93881
WireImpurityNon hazardousProprietary0.000000.010000.00011
Pure metalGold (Au)7440-57-50.0141399.990001.14234
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.