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Chemical content PSMN008-75B

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Type numberPackagePackage descriptionTotal product weight
PSMN008-75BSOT404D2PAK1440.95561 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934056399118912451245Cabuyao, Philippines; Manchester, United KingdomLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-38.00000100.000000.55519
subTotal8.00000100.000000.55519
Lead FrameCopper alloyCopper (Cu)7440-50-8823.4241699.0800057.14431
Iron (Fe)7439-89-61.246600.150000.08651
Nickel (Ni)7440-02-06.066810.730000.42103
Phosphorus (P)7723-14-00.332430.040000.02307
subTotal831.07000100.0000057.67492
Mould CompoundAdditiveBromine atom (Br)10097-32-25.705201.000000.39593
FillerMisc. Silica compounds (generic)14808-60-7439.3004077.0000030.48674
Flame retardantAntimony Trioxide (Sb2O3)1309-64-411.410402.000000.79186
PolymerEpoxy resin systemProprietary114.1040020.000007.91863
subTotal570.52000100.0000039.59316
Post-PlatingImpurityNon hazardousProprietary0.001980.010000.00014
Tin alloyTin (Sn)7440-31-519.7880299.990001.37326
subTotal19.79000100.000001.37340
Solder WireLead alloyLead (Pb)7439-92-16.8442093.500000.47498
Silver (Ag)7440-22-40.109801.500000.00762
Tin (Sn)7440-31-50.366005.000000.02540
subTotal7.32000100.000000.50800
WireImpurityNon hazardousProprietary0.000400.010000.00003
Pure metalAluminium (Al)7429-90-54.0000799.990000.27760
subTotal4.00047100.000000.27763
WireImpurityNon hazardousProprietary0.000030.010000.00000
Pure metalAluminium (Al)7429-90-50.2551199.990000.01770
subTotal0.25513100.000000.01770
total1440.95561100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.