Chemical content PSMN038-100YL

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Type numberPackagePackage descriptionTotal product weight
PSMN038-100YLSOT669LFPAK77.72000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934067517115312601260Seremban, Malaysia; Sherman, United States Of America; Cabuyao, Philippines; Dongguan, China; Manchester, United KingdomLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.60000100.000002.05867
ClipCopper alloyCopper (Cu)7440-50-84.9900099.800006.42048
Iron (Fe)7439-89-60.007500.150000.00965
Phosphorus (P)7723-14-00.002500.050000.00322
Lead FrameCopper alloyCopper (Cu)7440-50-837.8307699.8700048.67570
Iron (Fe)7439-89-60.037880.100000.04874
Phosphorus (P)7723-14-00.011360.030000.01462
Mould CompoundFillerSilica fused60676-86-013.7433061.0000017.68309
Flame retardantZinc Borate138265-88-02.2530010.000002.89887
PigmentCarbon black1333-86-40.067590.300000.08697
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.71077
Phenolic resinProprietary2.027709.000002.60898
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00050
Tin alloyTin (Sn)7440-31-53.8496299.990004.95318
Solder PasteLead alloyLead (Pb)7439-92-14.8747592.500006.27220
Silver (Ag)7440-22-40.131752.500000.16952
Tin (Sn)7440-31-50.263505.000000.33904
Solder PasteImpurityAntimony (Sb)7440-36-00.000480.030000.00061
Lead alloyLead (Pb)7439-92-11.4702792.470001.89176
Silver (Ag)7440-22-40.039752.500000.05115
Tin (Sn)7440-31-50.079505.000000.10229
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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