Chemical content PSMN040-100MSE

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Type numberPackagePackage descriptionTotal product weight
PSMN040-100MSESOT1210mLFPAK38.84333 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934067473115412601260Suzhou, China; Manchester, United Kingdom; Cabuyao, Philippines; Sherman, United States Of AmericaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.69333100.000004.35938
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000014.64499
Iron (Fe)7439-89-60.008550.150000.02201
Phosphorus (P)7723-14-00.002850.050000.00734
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000035.71321
Iron (Fe)7439-89-60.020850.150000.05368
Phosphorus (P)7723-14-00.006950.050000.01789
Mould CompoundFillerSilica fused60676-86-06.0563071.0000015.59161
PigmentCarbon black1333-86-40.025590.300000.06588
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.6804119.700004.32612
Phenolic resinProprietary0.767709.000001.97640
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00099
Tin alloyTin (Sn)7440-31-53.8496299.990009.91062
Solder PasteLead alloyLead (Pb)7439-92-14.7822592.5000012.31164
Silver (Ag)7440-22-40.129252.500000.33275
Tin (Sn)7440-31-50.258505.000000.66549
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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