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Chemical content PSMN057-200B

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Type numberPackagePackage descriptionTotal product weight
PSMN057-200BSOT404D2PAK1455.11146 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934056599118912451245Cabuyao, Philippines; Manchester, United KingdomLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-313.31209100.000000.91485
subTotal13.31209100.000000.91485
Lead FrameCopper alloyCopper (Cu)7440-50-8823.4241699.0800056.58839
Iron (Fe)7439-89-61.246600.150000.08567
Nickel (Ni)7440-02-06.066810.730000.41693
Phosphorus (P)7723-14-00.332430.040000.02285
subTotal831.07000100.0000057.11384
Mould CompoundAdditiveBromine atom (Br)10097-32-25.705201.000000.39208
FillerMisc. Silica compounds (generic)14808-60-7439.3004077.0000030.19015
Flame retardantAntimony Trioxide (Sb2O3)1309-64-411.410402.000000.78416
PolymerEpoxy resin systemProprietary114.1040020.000007.84160
subTotal570.52000100.0000039.20799
Post-PlatingImpurityNon hazardousProprietary0.001980.010000.00014
Tin alloyTin (Sn)7440-31-519.7880299.990001.35990
subTotal19.79000100.000001.36004
Solder WireLead alloyLead (Pb)7439-92-111.2200093.500000.77107
Silver (Ag)7440-22-40.180001.500000.01237
Tin (Sn)7440-31-50.600005.000000.04123
subTotal12.00000100.000000.82467
WireImpurityNon hazardousProprietary0.000030.010000.00000
Pure metalAluminium (Al)7429-90-50.2551199.990000.01753
subTotal0.25513100.000000.01753
WirePure metalAluminium (Al)7429-90-58.1634299.990000.56102
Nickel (Ni)7440-02-00.000820.010000.00006
subTotal8.16423100.000000.56108
total1455.11146100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.