Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN1R0-30YLD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN1R0-30YLDSOT669LFPAK85.610000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340682341154126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-34.500000100.0000005.256395
subTotal4.500000100.0000005.256395
ClipCopper alloyCopper (Cu)7440-50-84.99338199.8676205.832708
Iron (Fe)7439-89-60.0049960.0999100.005835
Phosphorus (P)7723-14-00.0016240.0324700.001896
subTotal5.000000100.0000005.840439
Lead FrameCopper alloyCopper (Cu)7440-50-837.83797199.81000044.198074
Iron (Fe)7439-89-60.0568650.1500000.066423
Phosphorus (P)7723-14-00.0151640.0400000.017713
subTotal37.910000100.00000044.282210
Mould CompoundFillerSilica fused60676-86-013.74330061.00000016.053382
Flame retardantZinc Borate138265-88-02.25300010.0000002.631702
PigmentCarbon black1333-86-40.0675900.3000000.078951
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.43841019.7000005.184453
Phenolic resinProprietary2.0277009.0000002.368532
subTotal22.530000100.00000026.317019
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.000450
Tin alloyTin (Sn)7440-31-53.84961599.9900004.496688
subTotal3.850000100.0000004.497138
Solder PasteLead alloyLead (Pb)7439-92-13.28375092.5000003.835708
Silver (Ag)7440-22-40.0887502.5000000.103668
Tin (Sn)7440-31-50.1775005.0000000.207336
subTotal3.550000100.0000004.146712
Solder PasteImpurityAntimony (Sb)7440-36-00.0024810.0300000.002898
Lead alloyLead (Pb)7439-92-17.64726992.4700008.932682
Silver (Ag)7440-22-40.2067502.5000000.241502
Tin (Sn)7440-31-50.4135005.0000000.483004
subTotal8.270000100.0000009.660086
total85.610000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.