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Chemical content PSMN2R9-30MLC

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Type numberPackagePackage descriptionTotal product weight
PSMN2R9-30MLCSOT1210mLFPAK38.85000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066936115512601260Hsin-chu, Taiwan; D-22529 HAMBURG, Germany; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.70000100.000004.37580
subTotal1.70000100.000004.37580
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000014.64247
Iron (Fe)7439-89-60.008550.150000.02201
Phosphorus (P)7723-14-00.002850.050000.00734
subTotal5.70000100.0000014.67182
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000035.70708
Iron (Fe)7439-89-60.020850.150000.05367
Phosphorus (P)7723-14-00.006950.050000.01789
subTotal13.90000100.0000035.77864
Mould CompoundFillerSilica fused60676-86-06.0563071.0000015.58893
PigmentCarbon black1333-86-40.025590.300000.06587
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.6804119.700004.32538
Phenolic resinProprietary0.767709.000001.97606
subTotal8.53000100.0000021.95624
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00099
Tin alloyTin (Sn)7440-31-53.8496299.990009.90892
subTotal3.85000100.000009.90991
Solder PasteLead alloyLead (Pb)7439-92-14.7822592.5000012.30952
Silver (Ag)7440-22-40.129252.500000.33269
Tin (Sn)7440-31-50.258505.000000.66538
subTotal5.17000100.0000013.30759
total38.85000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.