Chemical content PSMN3R0-30YLD

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Type numberPackagePackage descriptionTotal product weight
PSMN3R0-30YLDSOT669LFPAK90.90000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934067966115312601260Shanghai, China; D-22529 HAMBURG, Germany; Seremban, Malaysia; Cabuyao, Philippines; Hsin-chu, TaiwanLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.50000100.000001.65017
ClipCopper alloyCopper (Cu)7440-50-819.9735299.8676221.97307
Iron (Fe)7439-89-60.019980.099910.02198
Phosphorus (P)7723-14-00.006490.032470.00714
Lead FrameCopper alloyCopper (Cu)7440-50-837.8307699.8700041.61799
Iron (Fe)7439-89-60.037880.100000.04167
Phosphorus (P)7723-14-00.011360.030000.01250
Mould CompoundFillerSilica fused60676-86-013.7433061.0000015.11914
Flame retardantZinc Borate138265-88-02.2530010.000002.47855
PigmentCarbon black1333-86-40.067590.300000.07436
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700004.88274
Phenolic resinProprietary2.027709.000002.23069
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00042
Tin alloyTin (Sn)7440-31-53.8496299.990004.23500
Solder PasteLead alloyLead (Pb)7439-92-14.7545092.500005.23047
Silver (Ag)7440-22-40.128502.500000.14136
Tin (Sn)7440-31-50.257005.000000.28273
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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