Chemical content PSMN3R3-100SSF

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Type numberPackagePackage descriptionTotal product weight
PSMN3R3-100SSFSOT1235LFPAK88333.68865 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934661729118512601260Cardiff, Great Britain; Seremban, Malaysia; Cabuyao, Philippines; Sherman, United States Of America; Manchester, United KingdomLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-36.53565100.000001.95861
ClipCopper alloyCopper (Cu)7440-50-846.7774299.8600014.01828
Iron (Fe)7439-89-60.051530.110000.01544
Phosphorus (P)7723-14-00.014050.030000.00421
Lead FrameCopper alloyCopper (Cu)7440-50-8172.5480999.8600051.70931
Iron (Fe)7439-89-60.224630.130000.06732
Phosphorus (P)7723-14-00.051840.030000.01553
Mould CompoundFillerSilica -amorphous-7631-86-914.4075015.000004.31765
Silica fused60676-86-071.5572574.5000021.44432
PigmentCarbon black1333-86-40.480250.500000.14392
PolymerEpoxy resin systemProprietary4.802505.000001.43922
Phenolic resinProprietary4.802505.000001.43922
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00015
Tin alloyTin (Sn)7440-31-54.8795199.990001.46229
Solder PasteImpurityAntimony (Sb)7440-36-00.001300.030000.00039
Lead alloyLead (Pb)7439-92-13.9947092.470001.19714
Silver (Ag)7440-22-40.108002.500000.03237
Tin (Sn)7440-31-50.216005.000000.06473
Solder PasteImpurityAntimony (Sb)7440-36-00.000680.030000.00020
Lead alloyLead (Pb)7439-92-12.0990792.470000.62905
Silver alloySilver (Ag)7440-22-40.056752.500000.01701
Tin alloyTin (Sn)7440-31-50.113505.000000.03401
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.