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Chemical content PSMN6R0-25YLD

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Type numberPackagePackage descriptionTotal product weight
PSMN6R0-25YLDSOT669LFPAK88.27000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069914115112601260Cabuyao, Philippines; Seremban, Malaysia; Hsin-chu, TaiwanLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.62000100.000000.70239
subTotal0.62000100.000000.70239
ClipCopper alloyCopper (Cu)7440-50-819.9740099.8700022.62830
Iron (Fe)7439-89-60.020000.100000.02266
Phosphorus (P)7723-14-00.006000.030000.00680
subTotal20.00000100.0000022.65776
Lead FrameCopper alloyCopper (Cu)7440-50-837.8307699.8700042.85800
Iron (Fe)7439-89-60.037880.100000.04291
Phosphorus (P)7723-14-00.011360.030000.01287
subTotal37.88000100.0000042.91378
Mould CompoundFillerSilica fused60676-86-013.7433061.0000015.56962
Flame retardantZinc Borate138265-88-02.2530010.000002.55240
PigmentCarbon black1333-86-40.067590.300000.07657
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.02822
Phenolic resinProprietary2.027709.000002.29716
subTotal22.53000100.0000025.52397
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00044
Tin alloyTin (Sn)7440-31-53.8496299.990004.36118
subTotal3.85000100.000004.36162
Solder PasteLead alloyLead (Pb)7439-92-13.1357592.500003.55245
Silver (Ag)7440-22-40.084752.500000.09601
Tin (Sn)7440-31-50.169505.000000.19202
subTotal3.39000100.000003.84048
total88.27000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.