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Chemical content PSMN7R0-30MLC

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Type numberPackagePackage descriptionTotal product weight
PSMN7R0-30MLCSOT1210mLFPAK36.30000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066939115512601260D-22529 HAMBURG, Germany; Hsin-chu, Taiwan; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.84000100.000002.31405
subTotal
ClipCopper alloyPhosphorus (P)7723-14-00.002850.050000.00785
Iron (Fe)7439-89-60.008550.150000.02355
Copper (Cu)7440-50-85.6886099.8000015.67107
subTotal
Lead FrameCopper alloyIron (Fe)7439-89-60.020850.150000.05744
Phosphorus (P)7723-14-00.006950.050000.01915
Copper (Cu)7440-50-813.8722099.8000038.21543
subTotal
Mould CompoundFillerSilica fused60676-86-06.0563071.0000016.68402
PigmentCarbon black1333-86-40.025590.300000.07050
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.6804119.700004.62923
Phenolic resinProprietary0.767709.000002.11488
subTotal
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00106
Tin alloyTin (Sn)7440-31-53.8496299.9900010.60500
subTotal
Solder PasteLead alloySilver (Ag)7440-22-40.085752.500000.23623
Tin (Sn)7440-31-50.171505.000000.47245
Lead (Pb)7439-92-13.1727592.500008.74036
subTotal
total36.30000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.