Chemical content PSMN9R8-30MLC

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Type numberPackagePackage descriptionTotal product weight
PSMN9R8-30MLCSOT1210mLFPAK36.03000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934066941115512601260Hsin-chu, Taiwan; Cabuyao, Philippines; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.62000100.000001.72079
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000015.78851
Iron (Fe)7439-89-60.008550.150000.02373
Phosphorus (P)7723-14-00.002850.050000.00791
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000038.50180
Iron (Fe)7439-89-60.020850.150000.05787
Phosphorus (P)7723-14-00.006950.050000.01929
Mould CompoundFillerSilica fused60676-86-06.0563071.0000016.80905
PigmentCarbon black1333-86-40.025590.300000.07102
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.6804119.700004.66392
Phenolic resinProprietary0.767709.000002.13072
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00107
Tin alloyTin (Sn)7440-31-53.8496299.9900010.68447
Solder PasteLead alloyLead (Pb)7439-92-13.1727592.500008.80586
Silver (Ag)7440-22-40.085752.500000.23800
Tin (Sn)7440-31-50.171505.000000.47599
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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