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Chemical content PTVS45VP1UTP

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Type numberPackagePackage descriptionTotal product weight
PTVS45VP1UTPSOD128FlatPower33.92000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340655581156126030 s123520 s3D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.08000100.000003.18396
subTotal1.08000100.000003.18396
ClipCopper alloyCopper (Cu)7440-50-86.8411099.8700020.16832
Iron (Fe)7439-89-60.006850.100000.02019
Phosphorus (P)7723-14-00.002060.030000.00606
subTotal6.85000100.0000020.19457
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200034.29612
Iron (Fe)7439-89-60.011820.100000.03485
Phosphorus (P)7723-14-00.003550.030000.01045
Pure metal layerSilver (Ag)7440-22-40.171391.450000.50528
subTotal11.82000100.0000034.84670
Mould CompoundFillerSilica fused60676-86-08.0372071.0000023.69458
PigmentCarbon black1333-86-40.033960.300000.10012
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.2300419.700006.57441
Phenolic resinProprietary1.018809.000003.00354
subTotal11.32000100.0000033.37265
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.03174
subTotal0.35000100.000001.03184
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500006.81751
Silver alloySilver (Ag)7440-22-40.062502.500000.18426
Tin alloyTin (Sn)7440-31-50.125005.000000.36851
subTotal2.50000100.000007.37028
total33.92000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.