Chemical content PXN018-30QL

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Type numberPackagePackage descriptionTotal product weight
PXN018-30QLSOT8002-1MLPAK3321.56050 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934661595118312601235Hsin-chu, Taiwan; Dongguan, China; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.002311.000000.01071
FillerSilver (Ag)7440-22-40.1940484.000000.89998
PolymerBismaleimidodiphenylmethane resin 0.0231010.000000.10714
Isobornyl Methacrylate7534-94-30.011555.000000.05357
DieDoped siliconSilicon (Si)7440-21-30.33000100.000001.53058
Lead FrameCopper alloyCopper (Cu)7440-50-89.9547597.1100046.17122
Iron (Fe)7439-89-60.235772.300001.09354
Lead (Pb)7439-92-10.001030.010000.00475
Phosphorus (P)7723-14-00.007180.070000.03328
Zinc (Zn)7440-66-60.001030.010000.00475
Pure metal layerSilver (Ag)7440-22-40.051260.500000.23773
Mould CompoundAdditiveNon hazardousProprietary0.041790.410000.19381
FillerSilica -amorphous-7631-86-90.029560.290000.13709
Silica fused60676-86-08.7804186.1500040.72451
HardenerPhenolic resinProprietary0.437244.290002.02795
PigmentCarbon black1333-86-40.019360.190000.08982
PolymerEpoxy resin systemProprietary0.883658.670004.09845
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00008
Non hazardousProprietary0.000220.055500.00103
Tin solderTin (Sn)7440-31-50.3987699.940001.84950
WireImpurityNon hazardousProprietary0.000020.010000.00007
Pure metalCopper (Cu)7440-50-80.1574899.990000.73043
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.