Chemical content PZU2.4BL

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Type numberPackagePackage descriptionTotal product weight
PZU2.4BLSOD882DFN1006-20.92456 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340616513151212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.82201
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11324
Phenolic resinProprietary0.0013513.530000.14634
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.24479
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.90199
Magnesium (Mg)7439-95-40.000820.200000.08869
Nickel (Ni)7440-02-00.012923.150001.39688
Silicon (Si)7440-21-30.002830.690000.30598
Pure metal layerGold (Au)7440-57-50.000120.030000.01330
Nickel (Ni)7440-02-00.005211.270000.56319
Palladium (Pd)7440-05-30.000700.170000.07539
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.19451
Silica fused60676-86-00.2700060.0000029.20308
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.013503.000001.46015
Ion trapping agentBismuth (Bi)7440-69-90.002250.500000.24336
PigmentCarbon black1333-86-40.002250.500000.24336
PolymerEpoxy resin systemProprietary0.031507.000003.40703
Phenolic resinProprietary0.027006.000002.92031
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00120
Tin solderTin (Sn)7440-31-50.0199999.940002.16189
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0045699.990000.49316
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.