Chemical content PZU6.8BL

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Type numberPackagePackage descriptionTotal product weight
PZU6.8BLSOD882DFN1006-20.94456 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340616733151312601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.80461
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11085
Phenolic resinProprietary0.0013513.530000.14324
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.29347
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.01476
Magnesium (Mg)7439-95-40.000820.200000.08681
Nickel (Ni)7440-02-00.012923.150001.36730
Silicon (Si)7440-21-30.002830.690000.29950
Pure metal layerGold (Au)7440-57-50.000120.030000.01302
Nickel (Ni)7440-02-00.005211.270000.55126
Palladium (Pd)7440-05-30.000700.170000.07379
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000010.95748
Silica fused60676-86-00.2700060.0000028.58474
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.013503.000001.42924
Ion trapping agentBismuth (Bi)7440-69-90.002250.500000.23821
PigmentCarbon black1333-86-40.002250.500000.23821
PolymerEpoxy resin systemProprietary0.031507.000003.33489
Phenolic resinProprietary0.027006.000002.85847
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00118
Tin solderTin (Sn)7440-31-50.0199999.940002.11612
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0045699.990000.48272
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.