Chemical content TL431BIDBZR-Q

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Type numberPackagePackage descriptionTotal product weight
TL431BIDBZR-QSOT23TO-236AB9.16764 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934666180215112601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.33596
PolymerResin systemProprietary0.0092023.000000.10035
DieDoped siliconSilicon (Si)7440-21-30.41000100.000004.47225
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300033.78053
Iron (Fe)7439-89-60.082912.520000.90435
Lead (Pb)7439-92-10.000990.030000.01077
Phosphorus (P)7723-14-00.004940.150000.05383
Zinc (Zn)7440-66-60.006250.190000.06819
Pure metal layerSilver (Ag)7440-22-40.098042.980001.06944
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.22674
FillerSilica -amorphous-7631-86-90.014700.290000.16038
Silica fused60676-86-04.3678086.1500047.64372
HardenerPhenolic resinProprietary0.217504.290002.37251
PigmentCarbon black1333-86-40.009630.190000.10508
PolymerEpoxy resin systemProprietary0.439578.670004.79479
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000190.055500.00212
Tin solderTin (Sn)7440-31-50.3497999.940003.81549
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0076499.990000.08333
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.