Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content TLVH431NAIDBZR-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
TLVH431NAIDBZR-QSOT23TO-236AB8.995820 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346665732351126030 s123520 s3
9346665732151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.03080077.0000000.342381
PolymerResin systemProprietary0.00920023.0000000.102270
subTotal0.040000100.0000000.444651
DieDoped siliconSilicon (Si)7440-21-30.230000100.0000002.556743
subTotal0.230000100.0000002.556743
Lead FrameCopper alloyCopper (Cu)7440-50-83.09687794.13000034.425733
Iron (Fe)7439-89-60.0829082.5200000.921628
Lead (Pb)7439-92-10.0009870.0300000.010972
Phosphorus (P)7723-14-00.0049350.1500000.054859
Zinc (Zn)7440-66-60.0062510.1900000.069488
Pure metal layerSilver (Ag)7440-22-40.0980422.9800001.089862
subTotal3.290000100.00000036.572541
Mould CompoundAdditiveNon hazardousProprietary0.0207870.4100000.231074
FillerSilica -amorphous-7631-86-90.0147030.2900000.163443
Silica fused60676-86-04.36780586.15000048.553717
HardenerPhenolic resinProprietary0.2175034.2900002.417823
PigmentCarbon black1333-86-40.0096330.1900000.107083
PolymerEpoxy resin systemProprietary0.4395698.6700004.886369
subTotal5.070000100.00000056.359509
Post-PlatingImpurityLead (Pb)7439-92-10.0000160.0045000.000175
Non hazardousProprietary0.0001940.0555000.002159
Tin solderTin (Sn)7440-31-50.34979099.9400003.888361
subTotal0.350000100.0000003.890696
WirePure metalGold (Au)7440-57-50.015820100.0000000.175859
subTotal0.015820100.0000000.175859
total8.995820100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.