Chemical content XS3A4052PW

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Type numberPackagePackage descriptionTotal product weight
XS3A4052PWSOT403-1TSSOP1653.44156 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935691240118412601235Suzhou, China; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.21865
PolymerAcrylic resinProprietary0.0228015.200000.04266
Resin systemProprietary0.010356.900000.01937
DieDoped siliconSilicon (Si)7440-21-30.77542100.000001.45098
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.22501
Iron (Fe)7439-89-60.489842.400000.91659
Phosphorus (P)7723-14-00.006120.030000.01146
Zinc (Zn)7440-66-60.020410.100000.03819
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.78615
FillerSilica fused60676-86-025.0272079.0000046.83097
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.55678
PigmentCarbon black1333-86-40.063360.200000.11856
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.37119
Non hazardousProprietary1.298884.100002.43047
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.18559
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00561
Nickel (Ni)7440-02-00.2910097.000000.54452
Palladium (Pd)7440-05-30.006002.000000.01123
WirePure metalCopper (Cu)7440-50-80.12613100.000000.23602
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.