74LVC2G17

Dual non-inverting Schmitt trigger with 5 V tolerant input

The 74LVC2G17 is a dual buffer with Schmitt-trigger inputs. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

This device is fully specified for partial power down applications using I_OFF. The I_OFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

Wide supply voltage range from 1.65 V to 5.5 V
Overvoltage tolerant inputs to 5.5 V
High noise immunity
±24 mA output drive (V_CC = 3.0 V)
CMOS low-power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
I_OFF circuitry provides partial Power-down mode operation
Complies with JEDEC standard:
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD-8B/JESD36 (2.7 V to 3.6 V)
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C

Applications

Wave and pulse shapers for highly noisy environments

Parametrics

Type number	Product status	V_CC (V)	Logic switching levels	Output drive capability (mA)	f_max (MHz)	Nr of bits	Power dissipation considerations	T_amb (°C)	R_th(j-a) (K/W)	R_th(j-c) (K/W)	Package name
74LVC2G17GM	Production	1.65 - 5.5	CMOS/LVTTL	± 32	175	2	low	-40~125	290	145	XSON6
74LVC2G17GN	Production	1.65 - 5.5	CMOS/LVTTL	± 32	175	2	low	-40~125	274	170	XSON6
74LVC2G17GS	Production	1.65 - 5.5	CMOS/LVTTL	± 32	175	2	low	-40~125	271	176	XSON6
74LVC2G17GV	Production	1.65 - 5.5	CMOS/LVTTL	± 32	175	2	low	-40~125	232	145	TSOP6
74LVC2G17GW	Production	1.65 - 5.5	CMOS/LVTTL	± 32	175	2	low	-40~125	264	153	TSSOP6

Package

Type number	Package	Package information	Reflow-/Wave soldering	Packing	Status	Marking	Orderable part number, (Ordering code (12NC))
74LVC2G17GM	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_132	Active	VV	74LVC2G17GM,132 ( 9352 771 63132 )
74LVC2G17GM	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_115	Active	VV	74LVC2G17GM,115 ( 9352 771 63115 )
74LVC2G17GN	XSON6 (SOT1115)	SOT1115	REFLOW_BG-BD-1	SOT1115_132	Active	VV	74LVC2G17GN,132 ( 9352 918 03132 )
74LVC2G17GS	XSON6 (SOT1202)	SOT1202	REFLOW_BG-BD-1	SOT1202_132	Active	VV	74LVC2G17GS,132 ( 9352 929 31132 )
74LVC2G17GV	TSOP6 (SOT457)	SOT457	REFLOW_BG-BD-1 WAVE_BG-BD-1	SOT457_125	Active	VV	74LVC2G17GV,125 ( 9352 733 19125 )
74LVC2G17GW	TSSOP6 (SOT363-2)	SOT363-2		SOT363-2_125	Active	VV	74LVC2G17GW,125 ( 9352 733 21125 )

Environmental information

Type number	Orderable part number	Chemical content	Leadfree conversion date
74LVC2G17GM	74LVC2G17GM,132	74LVC2G17GM	Always Pb-free
74LVC2G17GM	74LVC2G17GM,115	74LVC2G17GM	Always Pb-free
74LVC2G17GN	74LVC2G17GN,132	74LVC2G17GN	Always Pb-free
74LVC2G17GS	74LVC2G17GS,132	74LVC2G17GS	Always Pb-free
74LVC2G17GV	74LVC2G17GV,125	74LVC2G17GV	Always Pb-free
74LVC2G17GW	74LVC2G17GW,125	74LVC2G17GW	Always Pb-free

Quality and reliability disclaimer

Documentation (19)

File name	Title	Type	Date
74LVC2G17	Dual non-inverting Schmitt trigger with 5 V tolerant input	Data sheet	2023-08-21
AN10161	PicoGate Logic footprints	Application note	2002-10-29
AN11009	Pin FMEA for LVC family	Application note	2019-01-09
lvc2g17	74LVC2G17 IBIS model	IBIS model	2014-10-20
Nexperia_Selection_guide_2023	Nexperia Selection Guide 2023	Selection guide	2023-05-10
MAR_SOT1202	MAR_SOT1202 Topmark	Top marking	2013-06-03
SOT1202	plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
SOT363-2	plastic thin shrink small outline package; 6 leads; body width 1.25 mm	Package information	2022-11-21
MAR_SOT1115	MAR_SOT1115 Topmark	Top marking	2013-06-03
SOT1115	plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body	Package information	2022-05-27
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
MAR_SOT886	MAR_SOT886 Topmark	Top marking	2013-06-03
SOT886	plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
MAR_SOT457	MAR_SOT457 Topmark	Top marking	2013-06-03
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08
SOT457	plastic, surface-mounted package (SC-74; TSOP6); 6 leads	Package information	2023-03-03
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06

Support

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Models

File name	Title	Type	Date
lvc2g17	74LVC2G17 IBIS model	IBIS model	2014-10-20

Ordering, pricing & availability

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