74AUP1G09-Q100
Low-power 2-input AND gate with open-drain
The 74AUP1G09-Q100 is a single 2-input AND gate with open-drain output. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 0.8 V to 3.6 V
CMOS low power dissipation
High noise immunity
Overvoltage tolerant inputs to 3.6 V
Low static power consumption; ICC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP1G09GW-Q100 | 0.8 - 3.6 | CMOS | 1.9 | 8.5 | 70 | 1 | ultra low | -40~125 | 309 | 79.2 | 179 | TSSOP5 |
| 74AUP1G09GZ-Q100 | 0.8 - 3.6 | CMOS | ultra low | -40~125 | XSON5 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74AUP1G09GW-Q100 | 74AUP1G09GW-Q100H (935690914125) |
Active | p9 |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74AUP1G09GZ-Q100 | 74AUP1G09GZ-Q100YL (935691746315) |
Active | p9 |
XSON5 (SOT8065-1) |
SOT8065-1 | SOT8065-1_315 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74AUP1G09GW-Q100 | 74AUP1G09GW-Q100H | 74AUP1G09GW-Q100 |
|
|
| 74AUP1G09GZ-Q100 | 74AUP1G09GZ-Q100YL | 74AUP1G09GZ-Q100 |
|
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Documentation (14)
| File name | Title | Type | Date |
|---|---|---|---|
| 74AUP1G09_Q100 | Low-power 2-input AND gate with open-drain | Data sheet | 2024-09-20 |
| AN11052 | Pin FMEA for AUP family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
| aup1g09 | 74AUP1G09 IBIS model | IBIS model | 2014-12-15 |
| Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| Leaflet_SOT8065_Minilogic | Leaflet_SOT8065 Minilogic | Leaflet | 2024-11-15 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT8065-1 | Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | Package information | 2024-09-24 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Ordering, pricing & availability
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