 
74HCS259
8-bit addressable latch with Schmitt-trigger inputs
The 74HCS259 is an 8-bit addressable latch. The device features four modes of operation. In the addressable latch mode, data on the D input is written into the latch addressed by the inputs A0 to A3. The addressed latch will follow the data input, non-addressed latches will retain their previous states. In memory mode, all latches retain their previous states and are unaffected by the data or address inputs. In the 3-to-8 decoding or demultiplexing mode, the addressed output follows the D input and all other outputs are LOW. In the reset mode, all outputs are forced LOW and unaffected by the data or address inputs. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
Features and benefits
- Wide supply voltage range from 2.0 V to 6.0 V 
- Schmitt-trigger inputs
- Low power consumption
- Typical supply current (ICC) of 100 nA
- Typical input leakage current (II) of ±10 nA
 
- ±7.8 mA output drive at 6 V
- Combined demultiplexer and 8-bit latch 
- Serial-to-parallel capability 
- Output from each storage bit available 
- Random (addressable) data entry 
- Easily expandable 
- Common reset input 
- Useful as a 3-to-8 active HIGH decoder 
- Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
- 
Complies with JEDEC standards:- JESD7A (2.0 V to 6.0 V)
 
- ESD protection: - HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V 
- CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V 
 
- Multiple package options 
- Specified from -40 °C to +85 °C and from -40 °C to +125 °C 
Parametrics
| Type number | VCC (V) | Logic switching levels | Power dissipation considerations | Tamb (°C) | Package name | 
|---|---|---|---|---|---|
| 74HCS259BQ | 2.0 - 6.0 | CMOS | low | -40~125 | DHVQFN16 | 
| 74HCS259D | 2.0 - 6.0 | CMOS | low | -40~125 | SO16 | 
| 74HCS259PW | 2.0 - 6.0 | CMOS | low | -40~125 | TSSOP16 | 
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing | 
|---|---|---|---|---|---|---|---|
| 74HCS259BQ | 74HCS259BQX (935692402115) | Active | S259 |   DHVQFN16 (SOT763-1) | SOT763-1 | SOT763-1_115 | |
| 74HCS259D | 74HCS259DJ (935692404118) | Active | 74HCS259D |   SO16 (SOT109-1) | SOT109-1 | SO-SOJ-REFLOW SO-SOJ-WAVE WAVE_BG-BD-1 | SOT109-1_118 | 
| 74HCS259PW | 74HCS259PWJ (935692400118) | Active | S259 |   TSSOP16 (SOT403-1) | SOT403-1 | SSOP-TSSOP-VSO-WAVE | SOT403-1_118 | 
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | 
|---|---|---|---|---|
| 74HCS259BQ | 74HCS259BQX | 74HCS259BQ |  |   | 
| 74HCS259D | 74HCS259DJ | 74HCS259D |  |   | 
| 74HCS259PW | 74HCS259PWJ | 74HCS259PW |  |   | 
Documentation (17)
| File name | Title | Type | Date | 
|---|---|---|---|
| 74HCS259 | 8-bit addressable latch with Schmitt-trigger inputs | Data sheet | 2025-10-30 | 
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 | 
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 | 
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 | 
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 | 
| 74hcs259 | 74HCS259 IBIS model | IBIS model | 2025-10-31 | 
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 | 
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 | 
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 | 
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 | 
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 | 
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 | 
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 | 
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 | 
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 | 
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 | 
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 | 
Support
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Models
| File name | Title | Type | Date | 
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 | 
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 | 
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 | 
| 74hcs259 | 74HCS259 IBIS model | IBIS model | 2025-10-31 | 
Ordering, pricing & availability
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