BSP31; BSP32; BSP33
Parametrics
| Type number | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP31 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 1300.0 | -60.0 | -1000.0 | 100.0 | 300.0 | 150 | 100.0 | Y |
| BSP33 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 1300.0 | -80.0 | -1000.0 | 100.0 | 300.0 | 150 | 100.0 | Y |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| BSP31 | BSP31,115 (933981970115) |
Active | BSP31 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
| BSP33 | BSP33,115 (933981990115) |
Active | BSP33 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| BSP32 | BSP32,115 (933981980115) |
Discontinued / End-of-life | BSP32 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| BSP31 | BSP31,115 | BSP31 |
|
|
| BSP33 | BSP33,115 | BSP33 |
|
|
All type numbers in the table below are discontinued.
Quality and reliability disclaimerDocumentation (9)
| File name | Title | Type | Date |
|---|---|---|---|
| BSP31_32_33 | PNP medium power transistors | Data sheet | 2025-04-08 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
| LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
| SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
Sample
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