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Click here for more information74LVC823ABQ
9-bit D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger; 3-state
Alternatives
Parametrics
| Type number | Package name |
|---|---|
| 74LVC823ABQ | DHVQFN24 |
PCB Symbol, Footprint and 3D Model
| Model Name | Description |
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Package
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC823ABQ | 74LVC823ABQ,115 (935275619115) |
Obsolete |
DHVQFN24 (SOT815-1) |
SOT815-1 | Not available | ||
| 74LVC823ABQ,118 (935275619118) |
Obsolete | SOT815-1_118 |
Environmental information
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC823ABQ | 74LVC823ABQ,115 | 74LVC823ABQ |
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| 74LVC823ABQ | 74LVC823ABQ,118 | 74LVC823ABQ |
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Documentation (10)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LVC823A | 9-bit D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger; 3-state | Data sheet | 2020-06-19 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| AN90063 | Questions about package outline drawings | Application note | 2025-09-15 |
| SOT815-1 | 3D model for products with SOT815-1 package | Design support | 2019-10-03 |
| lvc823a | lvc823a IBIS model | IBIS model | 2013-04-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN24_SOT815-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 3.5 mm x 5.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SOT815-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | Package information | 2021-08-17 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
Support
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Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
PCB Symbol, Footprint and 3D Model
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How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.