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Click here for more informationPHN210
Dual N-channel TrenchMOS intermediate level FET
Dual intermediate level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. This product is designed and qualified for use in computing, communications, consumer and industrial applications only.
Features and benefits
- Suitable for high frequency applications due to fast switching characteristics
- Suitable for logic level gate drive sources
- Suitable for low gate drive sources
Applications
- DC-to-DC convertors
- Logic level translators
- Motor and relay drivers
Parametrics
Type number | Package version | Package name | Product status | Channel type | Nr of transistors | Automotive qualified | Release date |
---|---|---|---|---|---|---|---|
PHN210 | SOT96-1 | SO8 | End of life | N | 2 | N | 2010-10-13 |
Package
All type numbers in the table below are discontinued.
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
PHN210 | PHN210,118 (934033430118) |
Obsolete | PHN210 Diffusion Batch Number n**** THAILAND |
SO8 (SOT96-1) |
SOT96-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT96-1_118 |
Environmental information
All type numbers in the table below are discontinued.
Quality and reliability disclaimerDocumentation (14)
File name | Title | Type | Date |
---|---|---|---|
PHN210 | Dual N-channel enhancement mode TrenchMOS (tm) transistor | Data sheet | 2001-12-31 |
AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
AN11160 | Designing RC Snubbers | Application note | 2023-02-03 |
AN11261 | RC Thermal Models | Application note | 2021-03-18 |
AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO8_SOT96-1_mk | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
SOT96-1 | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Package information | 2020-04-21 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
PHN210 | PHN210 SPICE model | SPICE model | 2012-06-08 |
TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2024-08-09 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
PHN210 | PHN210 SPICE model | SPICE model | 2012-06-08 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.