CBT3306
Parametrics
| Type number | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | f(-3dB) (MHz) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CBT3306GT | 4.5 - 5.5 | 3.9 | TTL | 7 | 300 | 2 | 0.25 | very low | -40~85 | 353 | 7.6 | 175 | XSON8 |
| CBT3306PW | 4.5 - 5.5 | 3.9 | TTL | 7 | 300 | 2 | 0.25 | very low | -40~85 | 120 | 30 | 87.5 | TSSOP8 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| CBT3306GT | CBT3306GT,115 (935290813115) |
Active | F06 |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 | |
| CBT3306PW | CBT3306PW,118 (935270498118) |
Active | 3306 |
TSSOP8 (SOT530-1) |
SOT530-1 | SOT530-1_118 |
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| CBT3306D | CBT3306D,112 (935270499112) |
Obsolete | CBT3306 |
SO8 (SOT96-1) |
SOT96-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
Not available |
| CBT3306D,118 (935270499118) |
Obsolete | CBT3306 | SOT96-1_118 | ||||
| CBT3306GM | CBT3306GM,125 (935290812125) |
Obsolete | F06 |
XQFN8 (SOT902-2) |
SOT902-2 | SOT902-2_125 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| CBT3306GT | CBT3306GT,115 | CBT3306GT |
|
|
| CBT3306PW | CBT3306PW,118 | CBT3306PW |
|
|
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| CBT3306D | CBT3306D,112 | CBT3306D |
|
|
| CBT3306D | CBT3306D,118 | CBT3306D |
|
|
| CBT3306GM | CBT3306GM,125 | CBT3306GM |
|
|
Documentation (19)
| File name | Title | Type | Date |
|---|---|---|---|
| CBT3306 | Dual bus switch | Data sheet | 2024-06-06 |
| AN90010 | Pin FMEA for CBT(D) family | Application note | 2019-10-28 |
| 002aab985 | Block diagram: CBT3306D, CBT3306PW | Block diagram | 2009-11-03 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| SOT530-1 | 3D model for products with SOT530-1 package | Design support | 2023-02-07 |
| cbt3306 | cbt3306 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO8_SOT96-1_mk | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| XQFN8_SOT902-2_mk | plastic, extremely thin quad flat package; 8 terminals; 0.55 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT96-1 | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Package information | 2020-04-21 |
| SOT902-2 | plastic, leadless extremely thin quad flat package; 8 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
| SOT530-1 | plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-03 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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