Orderable parts
| Type number | Orderable part number | Ordering code (12NC) | Package | Buy from distributors |
|---|---|---|---|---|
| XS3A1T5157GM | XS3A1T5157GMX | 935690971115 | SOT886 | Order product |
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Click here for more informationXS3A1T5157GM
Low-ohmic single-pole double-throw analog switch
The XS3A1T5157 is a low-ohmic single-pole double-throw analog switch suitable for use as an analog or digital 2:1 multiplexer/demultiplexer. It has a digital select input (S), two independent inputs/outputs (Y1 and Y2) and a common input/output (Z).
Schmitt trigger action at the digital input makes the circuit tolerant to slower input rise and fall times. Low threshold digital input allows this device to be driven by 1.8 V logic levels in 3.3 V applications without significant increase in supply current ICC. This makes it possible for the XS3A1T5157 to switch 4.3 V signals with a 1.8 V digital controller, eliminating the need for logic level translation. The XS3A1T5157 allows signals with amplitude up to VCC to be transmitted from Z to Y1 or Y2, or from Y1 or Y2 to Z. Its low ON resistance (0.5 Ω) and flatness (0.13 Ω) ensures minimal attenuation and distortion of transmitted signals.
Features and benefits
Wide supply voltage range from 1.4 V to 4.3 V
Very low ON resistance (peak):
1.6 Ω (typical) at VCC = 1.4 V
1.0 Ω (typical) at VCC = 1.65 V
0.55 Ω (typical) at VCC = 2.3 V
0.50 Ω (typical) at VCC = 2.7 V
0.50 Ω (typical) at VCC = 4.3 V
Break-before-make switching
High noise immunity
CMOS low-power consumption
Latch-up performance exceeds 100 mA per JESD78 Class II Level A
Low-switching threshold levels
Control input accepts voltages above supply voltage
Very low supply current, even when input is below VCC
High current handling capability (350 mA continuous current under 3.3 V supply)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 class 3B exceeds 8000 V
CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
IEC61000-4-2 contact discharge exceeds 8000 V for switch ports
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Applications
Mobile phone
Tablet / Notebook
Wearables
Parametrics
| Type number | Configuration | VCC (V) | Logic switching levels | RON (Ω) | RON(FLAT) (Ω) | f(-3dB) (MHz) | THD (%) | Xtalk (dB) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XS3A1T5157GM | SPDT-Z | 1.4 - 4.3 | CMOS/LVTTL | 0.5 | 0.2 | 40 | 0.03 | -90 | ultra low | -40~125 | 247 | 119 | XSON6 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| XS3A1T5157GM | XS3A1T5157GMX (935690971115) |
Active | aS |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| XS3A1T5157GM | XS3A1T5157GMX | XS3A1T5157GM |
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Series
Documentation (13)
| File name | Title | Type | Date |
|---|---|---|---|
| XS3A1T5157 | Low-ohmic single-pole double-throw analog switch | Data sheet | 2024-08-01 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| xs3a1t5157 | XS3A1T5157 IBIS model | IBIS model | 2020-09-11 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT886_115 | XSON6; Reel pack for SMD, 7''; Q1/T1 product orientation | Packing information | 2020-04-21 |
| XS3A1T5157GM_Nexperia_Product_Reliability | XS3A1T5157GM Nexperia Product Reliability | Quality document | 2025-03-20 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
Support
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Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
Models
| File name | Title | Type | Date |
|---|---|---|---|
| xs3a1t5157 | XS3A1T5157 IBIS model | IBIS model | 2020-09-11 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
Ordering, pricing & availability
| Type number | Orderable part number | Ordering code (12NC) | Status | Packing | Packing Quantity | Buy online |
|---|---|---|---|---|---|---|
| XS3A1T5157GM | XS3A1T5157GMX | 935690971115 | Active | SOT886_115 | 5,000 |
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Sample
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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.