74AUP1G125-Q100

Low-power buffer/line driver; 3-state

The 74AUP1G125-Q100 is a single buffer/line driver with 3-state output. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire V_CC range from 0.8 V to 3.6 V.

This device is fully specified for partial power down applications using I_OFF. The I_OFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

Automotive product qualification in accordance with AEC-Q100 (Grade 1)
- Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Complies with JEDEC standards:
- JESD8-12 (0.8 V to 1.3 V)
- JESD8-11 (0.9 V to 1.65 V)
- JESD8-7 (1.2 V to 1.95 V)
- JESD8-5 (1.8 V to 2.7 V)
- JESD8-B (2.7 V to 3.6 V)
Low static power consumption; I_CC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of V_CC
Input-disable feature allows floating input conditions
I_OFF circuitry provides partial Power-down mode operation
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

Parametrics

Type number	Product status	V_CC (V)	Logic switching levels	Output drive capability (mA)	f_max (MHz)	Nr of bits	Power dissipation considerations	T_amb (°C)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	Package name
74AUP1G125GM-Q100	Production	0.8 - 3.6	CMOS	± 1.9	70	1	ultra low	-40~125	311	7.7	157	XSON6
74AUP1G125GS-Q100	Production	0.8 - 3.6	CMOS	± 1.9	70	1	ultra low	-40~125	321	28.7	215	XSON6
74AUP1G125GW-Q100	Production	0.8 - 3.6	CMOS	± 1.9	70	1	ultra low	-40~125	309	79.2	179	TSSOP5

Package

Type number	Package	Package information	Reflow-/Wave soldering	Packing	Status	Marking	Orderable part number, (Ordering code (12NC))
74AUP1G125GM-Q100	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_115	Active	pM	74AUP1G125GM-Q100X ( 9356 907 26115 )
74AUP1G125GS-Q100	XSON6 (SOT1202)	SOT1202	REFLOW_BG-BD-1	SOT1202_125	Active	pM	74AUP1G125GS-Q100H ( 9356 907 72125 )
74AUP1G125GW-Q100	TSSOP5 (SOT353-1)	SOT353-1	WAVE_BG-BD-1	SOT353-1_125	Active	pM	74AUP1G125GW-Q100H ( 9353 007 66125 )

Environmental information

Type number	Orderable part number	Chemical content	Leadfree conversion date
74AUP1G125GM-Q100	74AUP1G125GM-Q100X	74AUP1G125GM-Q100	week 25, 2019
74AUP1G125GS-Q100	74AUP1G125GS-Q100H	74AUP1G125GS-Q100	week 25, 2019
74AUP1G125GW-Q100	74AUP1G125GW-Q100H	74AUP1G125GW-Q100	Always Pb-free

Quality and reliability disclaimer

Documentation (11)

File name	Title	Type	Date
74AUP1G125_Q100	Low-power buffer/line driver; 3-state	Data sheet	2023-07-11
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Leaflet	2019-04-12
Nexperia_Selection_guide_2023	Nexperia Selection Guide 2023	Selection guide	2023-05-10
MAR_SOT1202	MAR_SOT1202 Topmark	Top marking	2013-06-03
SOT1202	plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08
SOT353-1	plastic thin shrink small outline package; 5 leads; body width 1.25 mm	Package information	2022-11-15
MAR_SOT886	MAR_SOT886 Topmark	Top marking	2013-06-03
SOT886	plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06

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