 
74AUP2G0604
Low-power inverting buffer with open-drain and inverter
The 74AUP2G0604 is a single inverting buffer with open-drain output and a single inverter. It features two input pins (nA), an output pin (2Y) and an open-drain output pin (1Y).
Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Features and benefits
- Wide supply voltage range from 0.8 V to 3.6 V 
- High noise immunity 
- Complies with JEDEC standards: - JESD8-12 (0.8 V to 1.3 V) 
- JESD8-11 (0.9 V to 1.65 V) 
- JESD8-7 (1.2 V to 1.95 V) 
- JESD8-5 (1.8 V to 2.7 V) 
- JESD8-B (2.7 V to 3.6 V) 
 
- Low static power consumption; ICC = 0.9 μA (maximum) 
- Latch-up performance exceeds 100 mA per JESD 78 Class II 
- Inputs accept voltages up to 3.6 V 
- Low noise overshoot and undershoot < 10 % of VCC 
- IOFF circuitry provides partial power-down mode operation 
- ESD protection: - HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V 
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V 
 
- Multiple package options 
- Specified from -40 °C to +85 °C and -40 °C to +125 °C 
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | 
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP2G0604GM | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | 290 | 6.5 | 145 | XSON6 | 
| 74AUP2G0604GN | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | 275 | 11.7 | 171 | XSON6 | 
| 74AUP2G0604GS | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | 272 | 14.8 | 177 | XSON6 | 
| 74AUP2G0604GW | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | 264 | 38.6 | 153 | TSSOP6 | 
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing | 
|---|---|---|---|---|---|---|---|
| 74AUP2G0604GM | 74AUP2G0604GMH (935299653125) | Active | a6 |   XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_125 | 
| 74AUP2G0604GN | 74AUP2G0604GNH (935299654125) | Active | a6 |   XSON6 (SOT1115) | SOT1115 | REFLOW_BG-BD-1 | Not available | 
| 74AUP2G0604GS | 74AUP2G0604GSH (935299655125) | Active | a6 |   XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | Not available | 
| 74AUP2G0604GW | 74AUP2G0604GWH (935299656125) | Active | a6 |   TSSOP6 (SOT363-2) | SOT363-2 | SOT363-2_125 | 
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing | 
|---|---|---|---|---|---|---|---|
| 74AUP2G0604GF | 74AUP2G0604GFH (935299652125) | Obsolete |   XSON6 (SOT891) | SOT891 | REFLOW_BG-BD-1 | Not available | 
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | 
|---|---|---|---|---|
| 74AUP2G0604GM | 74AUP2G0604GMH | 74AUP2G0604GM |  |   | 
| 74AUP2G0604GN | 74AUP2G0604GNH | 74AUP2G0604GN |  |   | 
| 74AUP2G0604GS | 74AUP2G0604GSH | 74AUP2G0604GS |  |   | 
| 74AUP2G0604GW | 74AUP2G0604GWH | 74AUP2G0604GW |  |   | 
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | 
|---|---|---|---|---|
| 74AUP2G0604GF | 74AUP2G0604GFH | 74AUP2G0604GF |  |   | 
Documentation (26)
| File name | Title | Type | Date | 
|---|---|---|---|
| 74AUP2G0604 | Low-power inverting buffer with open-drain and inverter | Data sheet | 2023-07-24 | 
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 | 
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 | 
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 | 
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 | 
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 | 
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 | 
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 | 
| aup2g0604 | IBIS model | IBIS model | 2014-12-21 | 
| Nexperia_document_Logic_CombinationLogic_infocard_201710 | Combination logic solutions card | Leaflet | 2019-08-09 | 
| Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 | 
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 | 
| DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 | 
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 | 
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 | 
| XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 | 
| SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 | 
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 | 
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 | 
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 | 
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 | 
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 | 
| MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 | 
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 | 
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 | 
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 | 
Support
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Models
| File name | Title | Type | Date | 
|---|---|---|---|
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 | 
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 | 
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 | 
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 | 
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 | 
| aup2g0604 | IBIS model | IBIS model | 2014-12-21 | 
Ordering, pricing & availability
Sample
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