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BCP55-Q series

60 V, 1 A NPN medium power transistors

NPN medium power transistor series in a small SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.

Table 1. Product overview

Type number

Package

NPN complement

Nexperia

JEITA

BCP55-Q

SOT223

SC73

BCP52-Q

BCP55-10-Q

BCP52-10-Q

BCP55-16-Q

BCP52-16-Q

Features and benefits

  • High current

  • Three current gain selections

  • High power dissipation capability

  • Qualified according to AEC-Q101 and recommended for use in automotive applications

Applications

  • Linear voltage regulators

  • Power management

  • Low-side switches

  • MOSFET drivers

  • Battery-driven devices

  • Amplifiers

Parametrics

Type numberPackage versionPackage nameSize (mm)Ptot [max] (W)PolarityVCEO [max] (V)IC [max] (A)hFE [min]hFE [max]fT [typ] (MHz)fT [min] (MHz)Automotive qualified
BCP55-10-QSOT223SC-736.5 x 3.5 x 1.650.65NPN60163160180100Y
BCP55-16-QSOT223SC-736.5 x 3.5 x 1.650.65NPN60163250180100Y
BCP55-QSOT223SC-736.5 x 3.5 x 1.650.65NPN60163250180100Y

Package

Type numberPackagePackage informationReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
BCP55-10-Q
SC-73
(SOT223)
SOT223REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_115ActiveBCP55 /10BCP55-10-QX
( 9346 636 97115 )
BCP55-16-Q
SC-73
(SOT223)
SOT223REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_135ActiveBCP55 /16BCP55-16-QF
( 9346 636 96135 )
SOT223_115ActiveBCP55 /16BCP55-16-QX
( 9346 636 96115 )
BCP55-Q
SC-73
(SOT223)
SOT223REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_135ActiveBCP55BCP55-QF
( 9346 636 95135 )
SOT223_115ActiveBCP55BCP55-QX
( 9346 636 95115 )

Environmental information

Type numberOrderable part numberChemical contentRoHSRHF-indicatorLeadfree conversion date
BCP55-10-QBCP55-10-QXBCP55-10-Q
BCP55-16-QBCP55-16-QFBCP55-16-Q
BCP55-16-QBCP55-16-QXBCP55-16-Q
BCP55-QBCP55-QFBCP55-Q
BCP55-QBCP55-QXBCP55-Q
Quality and reliability disclaimer

Documentation (4)

File nameTitleTypeDate
BCP55-Q_SER60 V, 1 A NPN medium power transistorsData sheet2022-07-01
SOT223plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm bodyPackage information2022-05-30
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

Support

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Ordering, pricing & availability

Sample

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Sample orders normally take 2-4 days for delivery.

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