Nexperia's manufacturing facilities are fully vertically integrated and deliver optimized high-volume production. We offer the highest capacity in the industry for various packages, and make continuous investments in new capacities. We’re safeguarding the long-term availability of our manufacturing processes and products, so our customers can count on a secure supply.

Front End Fabrication

Stresemannallee 101
Hamburg Germany

The fab at our Hamburg site has existed since 1953 and now produces more than 1 million wafers per year on 8” and 6”. That translates to a capacity of 100 billion devices per year, making it the largest wafer fab optimized for bipolar small-signal and power discrete semiconductors in the world.

Pepper Rd,
Hazel Grove
Stockport SK7 5BJ
United Kingdom

The dedicated TrenchMOS wafer fab in Manchester is the original home of our power MOSFETs.  With production lines in both 6” and 8” it continues to build on a semiconductor legacy of more than 50 years at the site.

Assembly and Testing

Tianmei Industrial North
District A Section Huangjiang Town
China 523750

At over 80,000 m2 our facility in Guangdong is the largest small-signal assembly site with a capacity of over 50 billion pieces per year. It supports our high-runner and medium power SMD packages, as well as our DFN and wafer-scale options.

No. PT 12687, Tuanku Jaafar Industrial Park,
71450 Seremban,
Negeri Sembilan.

Focused on multi-pin and high diversity packages, our site at Seremban handles the other 20 billion small-signal and bipolar pieces per year. Among its specialties are “Japanese” SMD packages and our FlatPower and XSON packages.

Light Industry Science Park of the Phils
Philips Avenue, Barrio Diezmo
Cabuyao 4025
Laguna, Philippines

Just as Manchester is the home to front-end fabrication of our MOSFETs, the same can be said about Cabuyao for assembly and testing. Specializing in clip bond / power package capabilities (TO-220, DPAK, D2PAK, LFPAK), it can process approximately one billion pieces per year.